January  2025

X-ray inspection

We have added an X-ray inspection system to our machine park for in-process X-ray inspection. Hidden solder joints on BGA or QFN components can thus be inspected and soldering defects reliably detected. The software automatically evaluates Voids and calculates their percentage share of the soldering. This also ensures that production is carried out in accordance with IPC-A 610 Class II and III.

During the incoming parts inspection of semiconductors, the system also recognizes whether, for example, bonding wires are present and intact or whether no empty housings have been delivered for broker parts. It is also possible to check multilayer PCBs or pressed-in contacts. The resolution of less than 5µm and the full HD flat panel detector with 5-axis manipulator system enable the finest details to be recorded. The images can also be used for documentation purposes. With an area of 520x420mm, even large PCBs or panels can be inspected.

Digital Printing

With our new UV printer, we can now offer a further service for printing front panels and housings or creating front foils. Enclosures, front panels or lids up to 100mm high can be printed directly. The UV-active colours are cured directly by UV LEDs during printing so that the parts can be used immediately. This process also guarantees high UV resistance. All standard formats can be processed as templates - including PDF files. This means that our customers receive their products even faster, as we can now realise the printing in-house in addition to the mechanical processing.

March  2024

Component Test Station

For applications in aerospace, medical technology or to comply with ATEX standards, for example, passive components such as resistors, capacitors (MLCC) or ferrites in size 0201 and larger can now be measured and documented automatically during the assembly process. A component test station with an integrated, precise L-C-R meter from Rohde & Schwarz guarantees that all components are measured and the values recorded before placement. This can be done on a spot check basis or for all components to be assembled (100% testing). Our customers then receive a protocol for each assembly in which all target and actual values are documented.