X-ray inspection

We have added an X-ray inspection system to our machine park for in-process X-ray inspection. Hidden solder joints on BGA or QFN components can thus be inspected and soldering defects reliably detected. The software automatically evaluates Voids and calculates their percentage share of the soldering. This also ensures that production is carried out in accordance with IPC-A 610 Class II and III. 

During the incoming parts inspection of semiconductors, the system also recognizes whether, for example, bonding wires are present and intact or whether no empty housings have been delivered for broker parts. It is also possible to check multilayer PCBs or pressed-in contacts. The resolution of less than 5µm and the full HD flat panel detector with 5-axis manipulator system enable the finest details to be recorded. The images can also be used for documentation purposes. With an area of 520x420mm, even large PCBs or panels can be inspected.